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 Transistor
2SD0874, 2SD0874A (2SD874, 2SD874A)
Silicon NPN epitaxial planer type
For low-frequency power amplification Complementary to 2SB0766 (2SB766) and 2SB0766A (2SB766A)
Unit: mm
I Features
G G G
0.4max.
45
I Absolute Maximum Ratings
Parameter Collector to base voltage Collector to 2SD0874 2SD0874A 2SD0874 Symbol VCBO VCEO VEBO ICP IC PC* Tj Tstg
(Ta=25C)
Ratings 30 60 25 50 5 1.5 1 1 150 -55 ~ +150 Unit V
3
1.0-0.2
+0.1
0.40.08 0.50.08 1.50.1 3.00.15 2 1
4.0-0.20
0.40.04
emitter voltage 2SD0874A Emitter to base voltage Peak collector current Collector current Collector power dissipation Junction temperature Storage temperature
*
V
marking
V A A W C C
1:Base 2:Collector 3:Emitter EIAJ:SC-62 Mini Power Type Package
Printed circuit board: Copper foil area of 1cm2 or more, and the board thickness of 1.7mm for the collector portion
Marking symbol : Z(2SD0874) Y(2SD0874A)
I Electrical Characteristics
Parameter Collector cutoff current Collector to base voltage Collector to emitter voltage 2SD0874 2SD0874A 2SD0874 2SD0874A
(Ta=25C)
Symbol ICBO VCBO VCEO VEBO hFE1*1 hFE2 VCE(sat) VBE(sat) fT Cob Conditions VCB = 20V, IE = 0 IC = 10A, IE = 0 IC = 2mA, IB = 0 IE = 10A, IC = 0 VCE = 10V, IC = 500mA*2 VCE = 5V, IC = 1A*2 IC = 500mA, IB = 50mA*2 IC = 500mA, IB = 50mA*2 VCB = 10V, IE = -50mA, f = 200MHz VCB = 10V, IE = 0, f = 1MHz
*2
min
typ
max 0.1
Unit A V
30 60 25 50 5 85 50 0.2 0.85 200 20 0.4 1.2 160 340
Emitter to base voltage Forward current transfer ratio Collector to emitter saturation voltage Base to emitter saturation voltage Transition frequency Collector output capacitance
*1h FE1
MHz pF
Rank classification
Rank hFE1 Q 85 ~ 170 2SD0874 2SD0874A ZQ YQ R 120 ~ 240 ZR YR S 170 ~ 340 ZS YS
Pulse measurement
Marking Symbol
Note.) The Part numbers in the Parenthesis show conventional part number.
2.50.1
Large collector power dissipation PC. Low collector to emitter saturation voltage VCE(sat). Mini Power type package, allowing downsizing of the equipment and automatic insertion through the tape packing and the magazine packing.
4.50.1 1.60.2
1.50.1
2.60.1
+0.25
V V
V V
1
Transistor
PC -- Ta
1.4
2SD0874, 2SD0874A
IC -- VCE
Collector to emitter saturation voltage VCE(sat) (V)
1.50 Ta=25C 1.25 IB=10mA 9mA 1.00 8mA 7mA 6mA 0.75 5mA 4mA 0.50 3mA 2mA 0.25 1mA 10 3 1 0.3 0.1 0.03 0.01 0.003 0.001 0.01 0.03 Ta=75C 25C -25C
VCE(sat) -- IC
IC/IB=10
Collector power dissipation PC (W)
1.2
Printed circut board: Copper foil area of 1cm2 or more, and the board thickness of 1.7mm for the collector portion.
1.0
0.8
0.6
0.4
0.2
0 0 20 40 60 80 100 120 140 160
Collector current IC (A)
0 0 2 4 6 8 10
0.1
0.3
1
3
10
Ambient temperature Ta (C)
Collector to emitter voltage VCE (V)
Collector current IC (A)
VBE(sat) -- IC
100
hFE -- IC
IC/IB=10 600 VCE=10 200 VCB=10V Ta=25C
fT -- IE
Base to emitter saturation voltage VBE(sat) (V)
500
Transition frequency fT (MHz)
1 3 10
30 10 3 25C 1 0.3 0.1 0.03 0.01 0.01 0.03 Ta=-25C 75C
Forward current transfer ratio hFE
160
400
120
300 Ta=75C 200 25C 100 -25C
80
40
0.1
0.3
1
3
10
0 0.01 0.03
0.1
0.3
0 -1
-3
-10
-30
-100
Collector current IC (A)
Collector current IC (A)
Emitter current IE (mA)
Cob -- VCB
50 10 IE=0 f=1MHz Ta=25C
Area of safe operation (ASO)
Single pulse TC=25C
Collector output capacitance Cob (pF)
Collector current IC (A)
40
3 ICP 1 IC t=1s 0.3 DC
30
20
0.1
2SD0874A
0.03
0 1 3 10 30 100
0.01 0.1
0.3
1
3
10
2SD0874
10
30
100
Collector to base voltage VCB (V)
Collector to emitter voltage VCE (V)
2
Request for your special attention and precautions in using the technical information and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuit examples of the products. It does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (4) The products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) When using products for which dry packing is required, observe the conditions (including shelf life and after-unpacking standby time) agreed upon when specification sheets are individually exchanged. (7) No part of this material may be reprinted or reproduced by any means without written permission from our company.
Please read the following notes before using the datasheets
A. These materials are intended as a reference to assist customers with the selection of Panasonic semiconductor products best suited to their applications. Due to modification or other reasons, any information contained in this material, such as available product types, technical data, and so on, is subject to change without notice. Customers are advised to contact our semiconductor sales office and obtain the latest information before starting precise technical research and/or purchasing activities. B. Panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always the possibility that further rectifications will be required in the future. Therefore, Panasonic will not assume any liability for any damages arising from any errors etc. that may appear in this material. C. These materials are solely intended for a customer's individual use. Therefore, without the prior written approval of Panasonic, any other use such as reproducing, selling, or distributing this material to a third party, via the Internet or in any other way, is prohibited.
2001 MAR


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